OEM-56L-TF no-clean rosin-based lead-free tacky paste flux (ROL0)

56L-TF is a no-clean rosin-based tacky paste flux best suitable for lead-free alloys Sn96.5Ag3.0Cu0.5, Sn96.5Ag3.5, Sn99.3Cu0.7, Sn99Ag0.3Cu0.7.

56L-TF OEM chemistry does not contain QC-Aid, for UV-traceable version of 56L tacky solder flux refer to OEM NIG-TF

– ROL0 flux classification - no-clean
– Fine-tuned for Lead-free applications
– More activity for lead-free alloys
– Excellent wetting compatibility on most board finishes
– Clear residue; Doesn’t short components
– Wide process window – continue where you left off at a later time, once heated the flux will flow again

Product keynotes

– Rosin-based, more activity no-clean tacky solder flux best when used for operations with lead-free alloys and high-pitch solder powder in Medical Electronics and LED/Solar Industries, SAC alloys.

– Excellent tackiness – holds components in place, clear residue.

– Low viscosity – 20-46 (Malcom @ 10 RPM/25°C (x103mPa/s)) - easily flows under IC chips. Halide-free (<0.05%). Surface insulation (SIR) resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop).

– ROL0 classification – non-corrosive, doesn’t short circuits, can be left on board for multiple SMT assemblies. Clear residue can be easily removed by hot air, foam swab and basic solvents like isopropanol (best practice is to clean all flux residues all the time to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion).

– Industrial air-syringe intended for pneumatic dispensing machines – to manually control the flow use a dispensing kit (plunger and tip sold separately). Do not remove the piston/stopper! Do not discard the original nozzle cap, tighten the cap while not using the flux – flux may dry out upon extended contact with air. Keep at a room temperature – do not refrigerate.

OEM materials sold white-labeled, meaning outer package is labeled while individual items inside the pack are unlabeled. Ready for OEM manufacturing or BYOL re-marketing (Bring Your Own Label).

Designation

ROL0 classification - no-clean and not corrosive. Halide-free (<0.05%). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop)

Viscosity

mPa/s (Malcom @ 10 RPM/25ºC (x 10³mPa/s))

Disclaimer

The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.

Cleaning "No-Clean"

“No-clean” indicates cleaning method as defined by IPC standard and does not mean that the flux leaves no residue. No-clean rather means that the flux can be left on PCB for several consecutive SMT assemblies but also won’t cause corrosion if left indefinitely. However, cleaning can be necessary and it is desirable. No-clean fluxes are easily removed using industrial solvents in ultrasonic devices or using commercially available flux residue removers like STIRRI HydraSweep™.

Dispensing Kit

This product does not include any Dispensing Kit - a separate purchase!

Dispensing Kit is an add-on for manual dispensing, used to create a pressure with a plunger similarly to a medical syringe.

Air syringes intended for pneumatic dispensing machines use a piston stopper instead of a plunger. Do not remove the piston as it delivers the best seal preventing contact with air!

Compliance

This material is certified REACH-compliant - does not use any raw materials from the REACH restricted list of substances of high concern.

Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!

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