HT-TF specialty no-clean high temperature soldering tacky flux (ROL0)

STIRRI-HT-TF no-clean universal ROL0 soldering tacky paste flux for Hot Air rework and multi-step SMD semiconductors assembly - The Hot Air Flux.

Easy to clean using a foam swab, basic solvents like Isopropanol - cleans the best when the PCB is hot.

Hot Air station set to 350ºC-450ºC is a "cruise" temperature for the HT-TF - flux maintains clarity over pads, doesn't evaporate fast - doesn't require many top-ups.

Reach in solids, STIRRI®HT-TF™ withstands prolonged solder paste reflow profiles peaking at 350ºC for 5 minutes.

High ROI - a single tube lasts for a long time!

Odorless formulations with QC-Aid™ - glows in UV for optional instant visual PCB contamination inspection (UV light is not required to operate the flux).

Engineered for high temperatures, STIRRI-HT-TF outperforms universal and goto fluxes when it comes to prolonged flux action without degrading viscosity, color, transparency, or flux properties.

STIRRI-HT-TF used in composition of high-temperature solder paste with Sn10Pb88Ag2, Sn95Sb5, Sn95Ag5, Sn5Pb93.5Ag1.5, Sn5Pb93.5Ag2.5 solder alloys. Other powder compositions can be made available upon request.

Designation

ROL0 classification - no-clean and not corrosive. Halide-free (<0.05%). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop)

Viscosity

mPa/s (Malcom @ 10 RPM/25ºC (x 10³mPa/s))

Disclaimer

The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.

Cleaning "No-Clean"

“No-clean” indicates cleaning method as defined by IPC standard and does not mean that the flux leaves no residue. No-clean rather means that the flux can be left on PCB for several consecutive SMT assemblies but also won’t cause corrosion if left indefinitely. However, cleaning can be necessary and it is desirable. No-clean fluxes are easily removed using industrial solvents in ultrasonic devices or using commercially available flux residue removers like STIRRI HydraSweep™.

Dispensing Kit

This product does not include any Dispensing Kit - a separate purchase!

Dispensing Kit is an add-on for manual dispensing, used to create a pressure with a plunger similarly to a medical syringe.

Air syringes intended for pneumatic dispensing machines use a piston stopper instead of a plunger. Do not remove the piston as it delivers the best seal preventing contact with air!

Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds

STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!

With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!

Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.

Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.

STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.

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